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Freescale Selects Cabot Microelectronics' Epic(R) D100 CMP Polishing Pad

AURORA, Ill.--(BUSINESS WIRE)--Feb. 26, 2007--Cabot Microelectronics Corporation (NASDAQ: CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries to the semiconductor industry, today announced that Freescale Semiconductor has selected the Epic D100 CMP polishing pad for use in its manufacturing process.

Cabot Microelectronics and Freescale collaborated on the qualification, adoption and product ramp up for the Epic D100 pad technology. After an extensive evaluation that included on site trials and quality audits of Cabot Microelectronics' manufacturing processes and facilities, Freescale has selected the Epic D100 pad for various manufacturing processes at its wafer fabrication factories. Since its adoption six months ago, the Epic D100 pad has been running successfully in production.

"We worked extensively with Cabot Microelectronics to ensure the successful adoption of the Epic D100 CMP polishing pad and are pleased with the results we see in our manufacturing process," said Grant McEwan, CMP Process Engineering Section Manager, for Freescale's Austin Technology and Manufacturing Center. "The Epic D100 has proven to be cost-effective and durable. We intend to use it for multiple applications."

Dinesh Khanna, Cabot Microelectronic's Global Pads Business Director stated, "Customer collaboration is critical to our development and commercialization process. We are pleased that a world-class company like Freescale elected to partner with us and ultimately chose the Epic D100 for its CMP manufacturing process. We believe the Epic D100 represents a step change advantage in CMP polishing performance. As the industry leader in CMP slurry research and manufacturing, we intend to continue to devote the research and development necessary to develop products that provide maximum performance with the lowest possible cost of ownership."


The Epic D100 pad is based on proprietary technology and a state-of-the-art manufacturing process designed to improve pad performance and significantly lower cost-of-ownership. The Epic D100 has demonstrated significantly longer pad life than a conventional pad due to its material characteristics. The design features a single polymer material and is produced via a continuous single-sheet manufacturing process. This is designed to eliminate batch-to-batch and pad-to-pad inconsistencies found in a conventional pad. The Epic D100 can be customized to match customer grooving requirements in facilities located in the United States and Asia. The Epic D100 pad is available for 200mm and 300mm wafer polishing, with or without a window to detect the polishing end point. Cabot Microelectronics is establishing manufacturing capabilities to support worldwide customer demand for the Epic D100 with manufacturing capability for the production of 400,000 intermediate CMP pads annually.


Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, is the world's leading supplier of CMP slurries used in semiconductor and data storage manufacturing. The company's products play a critical role in the production of the most advanced semiconductor devices, enabling the manufacture of smaller, faster and more complex devices by its customers. Since becoming an independent public company in 2000, the company has grown to approximately 750 employees who work at research and development labs, sales and business offices, manufacturing facilities and customer service centers in China, France, Germany, Japan, Singapore, South Korea, Taiwan, the United Kingdom and the United States. The company's vision is to become the world leader in shaping, enabling and enhancing the performance of surfaces, and thus looks beyond its core CMP business in the semiconductor industry. For more information about Cabot Microelectronics Corporation, visit or contact Bill Johnson, Vice-President and CFO at 630-499-2600.


This news release may include statements that constitute "forward looking statements" within the meaning of federal securities regulations. These forward-looking statements include statements related to: future sales and operating results; company and industry growth and trends; growth of the markets in which the company participates; international events; product performance; the generation, protection and acquisition of intellectual property; new product introductions; development of new products, technologies and markets; the acquisition of or investment in other entities; and the construction of new or refurbishment of existing facilities by Cabot Microelectronics Corporation. These forward-looking statements involve a number of risks, uncertainties, and other factors, including those described from time to time in Cabot Microelectronics' filings with the Securities and Exchange Commission (SEC), that could cause actual results to differ materially from those described by these forward-looking statements. In particular, see "Risk Factors" in the company's annual report on Form 10-K for the fiscal year ended September 30, 2006, and in the company's quarterly report on Form 10-Q for the quarter ended December 31, 2006, both filed with the SEC. Cabot Microelectronics assumes no obligation to update this forward-looking information.

CONTACT: Cabot Microelectronics Corporation
Bill Johnson, 630-499-2600
Vice-President and CFO

SOURCE: Cabot Microelectronics Corporation

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