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Cabot Microelectronics Corporation's Epic(R) D100 CMP Polishing Pad Receives Award from Semiconductor International Magazine

AURORA, Ill.--(BUSINESS WIRE)--Jul. 15, 2009-- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world’s leading supplier of chemical mechanical planarization (CMP) polishing slurries and growing CMP pad supplier to the semiconductor industry, announced today that its Epic D100 CMP polishing pad has received Semiconductor International (SI) Magazine’s “Editors’ Choice Best Products” award for 2009.

“The Editors' Choice Best Products awards program by SI acknowledges products, materials and services that are proven in the manufacturing environment," said Laura Peters, Editor-in-Chief of Semiconductor International. SI's editors evaluate the products based on feedback from customers in the field and only the most highly recommended ones are honored each year.

William Noglows, Chairman and CEO of Cabot Microelectronics commented, “It is an honor to receive this prestigious award from SI, which we believe reflects our customers’ satisfaction with the high performance of our Epic D100 polishing pad across a variety of commercial applications, as well as its compelling cost of ownership. We look forward to expanding the adoption of our CMP pads in the semiconductor industry through the continued execution of our key initiatives of Technology Leadership, Operations Excellence, and Connecting with Customers.”

ABOUT THE EPIC D100 CMP POLISHING PAD

The Epic D100 pad is based on proprietary material technology and a state-of-the-art manufacturing process designed to improve pad performance, lower the cost of ownership and provide superior quality. The Epic D100 has demonstrated significantly longer pad life and lower overall defectivity than a conventional pad due to its material characteristics. The design features a single polymer material and is produced via a continuous single-sheet manufacturing process. This is designed to eliminate batch-to-batch and pad-to-pad inconsistencies found in a conventional pad. The Epic D100 can be customized to match customer grooving requirements in facilities located in the United States and Asia. The Epic D100 pad is available for 200mm and 300mm wafer polishing, with or without a window to detect the polishing end point. Cabot Microelectronics has intermediate pad manufacturing capabilities to support approximately 30 percent of worldwide customer demand for CMP pads. The materials and technology behind the Epic D100 CMP polishing pad are protected by an international portfolio of patents.

ABOUT CABOT MICROELECTRONICS CORPORATION

Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, is the world's leading supplier of CMP polishing slurries and growing CMP pad supplier to the semiconductor industry. The company's products play a critical role in the production of the most advanced semiconductor devices, enabling the manufacture of smaller, faster and more complex devices by its customers. Since becoming an independent public company in 2000, the company has grown to approximately 900 employees globally. The company's vision is to become the world leader in shaping, enabling and enhancing the performance of surfaces, so the company is leveraging its expertise in CMP slurry formulation, materials and polishing techniques developed for the semiconductor industry and applying it to demanding surface modification applications in other industries where shaping, enabling and enhancing the performance of surfaces is critical to success. For more information about Cabot Microelectronics Corporation, visit www.cabotcmp.com or contact Amy Ford, Director of Investor Relations at (630) 499-2600.

SAFE HARBOR STATEMENT

This news release may include statements that constitute “forward looking statements” within the meaning of federal securities regulations. These forward-looking statements include statements related to: future sales and operating results; company and industry growth, contraction or trends; growth or contraction of the markets in which the company participates; international events or various economic factors; product performance; the generation, protection and acquisition of intellectual property, and litigation related to such intellectual property; new product introductions; development of new products, technologies and markets; the acquisition of or investment in other entities; uses and investment of the company’s cash balance; and the construction of facilities by Cabot Microelectronics Corporation. These forward-looking statements involve a number of risks, uncertainties, and other factors, including those described from time to time in Cabot Microelectronics’ filings with the Securities and Exchange Commission (SEC), that could cause actual results to differ materially from those described by these forward-looking statements. In particular, see "Risk Factors" in the company's quarterly report on Form 10-Q for the quarter ended March 31, 2009 and in the company's annual report on Form 10-K for the fiscal year ended September 30, 2008, both filed with the SEC. Cabot Microelectronics assumes no obligation to update this forward-looking information.

Source: Cabot Microelectronics Corporation

Cabot Microelectronics Corporation
Amy Ford, Director of Investor Relations
(630) 499-2600

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