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Cabot Microelectronics Corporation Announces a Major Advance in CMP Polishing Pads, the Epic(R) D100

AURORA, Ill.--(BUSINESS WIRE)--Jan. 3, 2007--Cabot Microelectronics Corporation (NASDAQ:CCMP), the leading supplier of chemical mechanical planarization (CMP) polishing slurries to the semiconductor industry, announces the global introduction of its new CMP polishing pad, the Epic D100.

The Epic D100 pad represents what we believe is a major breakthrough in CMP polishing pad technology. Currently used in high volume manufacturing by integrated circuit device manufacturers, the Epic D100 is the result of extensive research intended to deliver a step change improvement in CMP pad life and pad-to-pad consistency. Customers are successfully qualifying and using the Epic D100 for dielectric, shallow trench isolation, tungsten and copper processes.

Cabot Microelectronics Corporation is establishing manufacturing capabilities to support worldwide customer demand for the Epic D100. This includes manufacturing capability for the production of 400,000 intermediate CMP pads annually. The Epic D100 can also be customized to match customer grooving requirements (current capacity of 120,000 pads annually) in facilities located in the United States and Asia. The Epic D100 pad is available for 200mm and 300mm wafer polishing, with or without a window to detect the polishing end point.

The Epic D100 pad is based on proprietary technology and a state-of-the-art manufacturing process designed to improve pad performance and significantly lower cost-of-ownership. The Epic D100 has demonstrated up to a 30% longer pad life than the conventional pad due to its material characteristics. The design features a single polymer material and is produced via a continuous single-sheet manufacturing process. This is designed to eliminate batch-to-batch and pad-to-pad inconsistencies found in the conventional pad.

The Epic D100 pad is manufactured with extensive quality control. In addition to testing the typical pad physical properties, Cabot Microelectronics Corporation has developed unique quality control methods that check every pad for groove dimensions and window integrity. The materials and technology behind the Epic D100 pad are protected by an international portfolio of patents.

William Noglows, Chairman, and CEO of Cabot Microelectronics Corporation said, "We believe slurry and pad consumable sets can enable a quantum leap in CMP polishing performance. As the industry leader in CMP slurry research and manufacturing, we understand the critical relationship between slurry and pads and the applied science required to provide maximum performance with optimal cost of ownership. As a result, we believe Cabot Microelectronics is uniquely qualified to offer customers the most advanced CMP polishing solutions and we are excited about this new addition to our robust product line."

ABOUT CABOT MICROELECTRONICS CORPORATION

Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, is the world's leading supplier of CMP slurries used in semiconductor and data storage manufacturing. The company's products play a critical role in the production of the most advanced semiconductor devices, enabling the manufacture of smaller, faster and more complex devices by its customers. Since becoming an independent public company in 2000, the company has grown to nearly 750 employees who work at research and development labs, sales and business offices, manufacturing facilities and customer service centers in China, France, Germany, Japan, Singapore, South Korea, Taiwan, the United Kingdom and the United States. The company's vision is to become the world leader in shaping, enabling and enhancing the performance of surfaces, and thus looks beyond its core CMP business in the semiconductor industry. For more information about Cabot Microelectronics Corporation, visit www.cabotcmp.com or contact Barbara Ven Horst, Director of Investor Relations at (630) 375-5412.

SAFE HARBOR STATEMENT

This news release may include statements that constitute "forward looking statements" within the meaning of federal securities regulations. These forward-looking statements include statements related to: future sales and operating results; company and industry growth and trends; growth of the markets in which the company participates; international events; product performance; the generation, protection and acquisition of intellectual property; new product introductions; development of new products, technologies and markets; the acquisition of or investment in other entities; and the construction of new or refurbishment of existing facilities by Cabot Microelectronics Corporation. These forward-looking statements involve a number of risks, uncertainties, and other factors, including those described from time to time in Cabot Microelectronics' filings with the Securities and Exchange Commission (SEC), that could cause actual results to differ materially from those described by these forward-looking statements. In particular, see "Risks Related to Our Business" in Management's Discussion and Analysis in our annual report on Form 10-K for the fiscal year ended September 30, 2006, filed with the SEC. Cabot Microelectronics assumes no obligation to update this forward-looking information.

CONTACT: Cabot Microelectronics Corporation
Barbara Ven Horst, 630-375-5412

SOURCE: Cabot Microelectronics Corporation

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