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Cabot Microelectronics Announces a Major Breakthrough in Tungsten CMP Technology with WIN(TM) CMP Slurries

AURORA, Ill.--(BUSINESS WIRE)--May 30, 2007--Cabot Microelectronics Corporation (NASDAQ: CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries to the semiconductor industry, announces a major breakthrough in its CMP technology with the WIN(TM) platform of tungsten CMP slurries for advanced technology nodes.

The WIN(TM) platform of CMP slurries was a winner of the 2006 "Best Innovative Product" award at SEMICON West 2006. The WIN(TM) product line is the result of extensive research and development by Cabot Microelectronics intended to deliver best-in-class performance at advanced technology nodes with ease-of-use, cleanliness and flexibility to various integration schemes. The WIN(TM) product line is being successfully used in high volume manufacturing by numerous integrated circuit manufacturers for advanced tungsten CMP processes.

Cabot Microelectronics' WIN(TM) product line is non-hazardous and environmentally friendly as it is based on hydrogen peroxide technology. The product platform is composed of two main product classes: WIN(TM) W7000 and WIN(TM) W7300.

WIN(TM) W7000 is a high selectivity slurry that builds on Cabot Microelectronics' industry leading Semi-Sperse(R) W2000 platform. WIN(TM) W7000 includes fumed silica abrasives and a proprietary etch inhibitor technology that provides best-in-class planarization performance with a wide over-polish window and substantially reduced edge-over-erosion.

WIN(TM) W7300 is a tunable selective slurry made with an ultra-pure colloidal particle that results in excellent planarization, edge-over-erosion and defectivity performance. WIN(TM) W7300 chemistry is compatible with other Cabot Microelectronic tungsten slurries. Additionally, WIN(TM) W7300 has been used very successfully as a "buff" on a hard pad using the same platen.

Dr. Robert Vacassy, Cabot Microelectronics' Development Manager for Tungsten and Advanced Dielectrics, stated "Our new line of advanced tungsten products was designed to provide customers with maximum flexibility to customize for their specific processes. Further, the WIN(TM) platform of products offers customers unmatched performance with optimal cost of ownership."


Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, is the world's leading supplier of CMP slurries used in semiconductor and data storage manufacturing. The company's products play a critical role in the production of the most advanced semiconductor devices, enabling the manufacture of smaller, faster and more complex devices by its customers. Since becoming an independent public company in 2000, the company has grown to approximately 750 employees who work at research and development labs, sales and business offices, manufacturing facilities and customer service centers in China, France, Germany, Japan, Singapore, South Korea, Taiwan, the United Kingdom, and the United States. The company's vision is to become the world leader in shaping, enabling and enhancing the performance of surfaces, so the company is leveraging its expertise in CMP slurry formulation, materials and polishing techniques developed for the semiconductor industry and applying it to demanding surface modification applications in other industries where shaping, enabling and enhancing the performance of surfaces is critical to success. For more information about Cabot Microelectronics Corporation, visit or contact Amy Ford, Director of Investor Relations, at 630-499-2600.


This news release may include statements that constitute "forward looking statements" within the meaning of federal securities regulations. These forward-looking statements include statements related to: future sales and operating results; company and industry growth or trends; growth of the markets in which the company participates; international events; product performance; the generation, protection and acquisition of intellectual property, and litigation related to such intellectual property; new product introductions; development of new products, technologies and markets; the acquisition of or investment in other entities; and the construction of new or refurbishment of existing facilities by Cabot Microelectronics Corporation. These forward-looking statements involve a number of risks, uncertainties, and other factors, including those described from time to time in Cabot Microelectronics' filings with the Securities and Exchange Commission (SEC), that could cause actual results to differ materially from those described by these forward-looking statements. In particular, see "Risk Factors" in the company's quarterly report on Form 10-Q for the quarter ended March 31, 2007 and in the company's annual report on Form 10-K for the fiscal year ended September 30, 2006, both filed with the SEC. Cabot Microelectronics assumes no obligation to update this forward-looking information.

CONTACT: Cabot Microelectronics Corporation
Director of Investor Relations
Amy Ford, 630-499-2600

SOURCE: Cabot Microelectronics Corporation

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